Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source

ABSTRACT

A two-dimensional light source includes a base substrate having holes, wires disposed on a lower surface of the base substrate, a light emitting diode (LED) chip disposed on an upper surface of the base substrate, plugs that connect two electrodes of the LED chip to the wires through the holes, a buffer layer covering the LED chip, and an optical layer that is disposed on the buffer layer and has an optical pattern formed at a portion of the optical layer corresponding to the LED chip.

This application claims priority to Korean Patent Application No.2005-007126 filed in the Korean Intellectual Property Office on Jan. 26,2005, and all the benefits accruing therefrom under 35 U.S.C §119, andthe contents of which in its entirety are herein incorporated byreference.

BACKGROUND OF THE INVENTION

(a) Field of the Invention The present invention relates generally to atwo-dimensional light source using light emitting diodes (LEDs), andmore particularly to a surface light source used in backlighting aliquid crystal display (LCD) device and an LCD device using the same.

(b) Description of the Related Art

Display devices used to display images, such as television receivers andcomputer monitors, are classified into self-luminescence display devicescapable of self-emitting and light receiving display devices requiring aseparate light source. Light emitting diodes (LEDs), electroluminescence(EL) devices, vacuum fluorescent display (VFD) devices, field emissiondisplay (FED) devices, plasma display panel (PDP) devices, etc., areincluded among self-luminescence display devices, while liquid crystaldisplay (LCD) devices, etc., are included among light receiving displaydevices.

Generally, an LCD device includes two panels that each have fieldgenerating electrodes on their inner surfaces, and a dielectricanisotropy liquid crystal layer interposed between the two panels. Inthe LCD device, a variation of a voltage difference between the fieldgenerating electrodes, i.e., a variation in strength of an electricfield generated by the field generating electrodes, changes thetransmittance of light passing through the LCD device, and thus imagesare obtained by controlling the voltage difference between the fieldgenerating electrodes. In the LCD device, light may be either naturallight or artificial light emitted by a light source separately employedin the LCD device.

A backlight is a representative device for providing artificial light tothe LCD device and utilizes light emitting diodes (LEDs) or fluorescentlamps, such as cold cathode fluorescent lamps (CCFLs), externalelectrode fluorescent lamps (EEFLs), etc., as the light source.

LEDs have eco-friendly characteristics since they do not use mercury(Hg), and a working lifetime of the LEDs is longer than workinglifetimes of most other light sources due to stable characteristics ofthe LEDs. For these reasons, LEDs are especially popular for use asnext-generation light sources.

However, light emitted from the LEDs tends to be condensed to asubstantially narrow area. Accordingly, for applying the LEDs to asurface light source (two-dimensional light source), various opticalfilms capable of distributing light to a wider region are required.Additionally, a space for allowing light dispersion within the LCDdevice is required. An assembly process of such optical films makes afabrication process of the LCD device more complex and the spacerequired for allowing light dispersion may impede fabrication of athinner device.

SUMMARY OF THE INVENTION

An objective of the present invention is to make a light source usinglight emitting diodes (LEDs) slimmer. Another objective of the presentinvention is to simplify an assembly process of a backlight for an LCDdevice.

To achieve the objectives, according to an aspect of the presentinvention, there is provided a two-dimensional light source comprising abase substrate, a wire member, a light emitting diode (LED) chip, a plugmember, a buffer layer, and an optical layer. The base substrate has alower surface and an upper surface and a hole. The hole penetrates thebase substrate. The wire member is disposed on a lower surface of thebase substrate. The LED chip is disposed on the upper surface of thebase substrate and has an electrode member. The plug member is disposedin the hole and connects the electrode member to the wire member throughthe hole. The buffer layer that covers the LED chip. The optical layeris disposed on the buffer layer and includes a pattern member disposedat a portion of the optical layer corresponding to the LED chip.

According to another aspect of the present invention, there is provideda two-dimensional light source comprising two-dimensional light sourcemodules arranged substantially in a matrix. Each light source moduleincludes a base substrate having holes, wires disposed on a lowersurface of the base substrate, a light emitting diode (LED) chipdisposed on an upper surface of the base substrate, plugs that connectelectrodes of the LED chip to the wires through the holes, a bufferlayer that covers the LED chip, and an optical layer disposed on thebuffer layer and including an optical pattern formed at a portion of theoptical layer corresponding to the LED chip.

According to still another aspect of the present invention, there isprovided a liquid crystal display (LCD) device comprising atwo-dimensional light source and a liquid crystal panel assembly that isdisposed proximate to the two-dimensional light source and includes twopanels and a liquid crystal layer interposed between the two panels. Inthis structure, the two-dimensional light source includes a printedcircuit board (PCB) substrate having holes passing from a lower surfaceto an upper surface of the PCB substrate, wires disposed on the lowersurface of the PCB substrate, a heat radiating substrate that has holespassing from a lower surface to an upper surface of the heat radiatingsubstrate and whose lower surface is attached to the upper surface ofthe PCB substrate, a light emitting diode (LED) chip disposed on theupper surface of the heat radiating substrate, plugs that connectelectrodes of the LED chip to the wires through the holes of the PCB andheat radiating substrates, a buffer layer that covers the LED chip, andan optical layer disposed on the buffer layer and including an opticalpattern formed at a portion of the optical layer corresponding to theLED chip.

This liquid crystal display device may further comprise two polarizersprovided at both sides of the liquid crystal panel assembly.

This liquid crystal display device may further comprise an optical filmprovided between the two-dimensional light source and the liquid crystalpanel assembly.

In this structure, an upper surface of the buffer layer may beplanarized.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects or advantages of the present invention willbecome more apparent by describing exemplary embodiments thereof ingreater detail with reference to the accompanying drawings, in which:

FIG. 1 is a block diagram of an LCD device according to an exemplaryembodiment of the present invention;

FIG. 2 is an exploded perspective view schematically illustrating an LCDdevice according to an exemplary embodiment of the present invention;

FIG. 3 is an equivalent circuit view of a pixel unit of an LCD deviceaccording to an exemplary embodiment of the present invention;

FIG. 4 is a cross-sectional view of a two-dimensional light source usingLEDs according to an exemplary embodiment of the present invention;

FIG. 5 is a cross-sectional view of a two-dimensional light source usingLEDs according to another exemplary embodiment of the present invention;

FIG. 6 is a cross-sectional view of a two-dimensional light source usingLEDs according to an additional exemplary embodiment of the presentinvention;

FIG. 7 is a cross-sectional view of a two-dimensional light source usingLEDs according to yet another exemplary embodiment of the presentinvention;

FIG. 8 is a cross-sectional view of a two-dimensional light source usingLEDs according to still another exemplary embodiment of the presentinvention;

FIG. 9 to FIG. 11 are cross-sectional views of various LEDs used for atwo-dimensional light source according to exemplary embodiments of thepresent invention;

FIG. 12 is a plan view of a two-dimensional light source using LEDsaccording to another exemplary embodiment of the present invention; and

FIG. 13 is a cross-sectional view taken along line XIII-XIII′ of FIG.12.

DETAILED DESCRIPTION OF THE INVENTION

Exemplary embodiments of the present invention will be described morefully hereinafter with reference to the accompanying drawings, in whichexemplary embodiments of the invention are shown. The present inventionmay, however, be embodied in different forms and should not be construedas being limited to the embodiments set forth herein. Rather, theseexemplary embodiments are provided so that this disclosure will bethorough and complete, and will fully convey the scope of the inventionto those skilled in the art.

In the drawings, thickness and/or size of layers, films, and regions areexaggerated for clarity. Like numerals refer to like elementsthroughout. It will be understood that when an element such as a layer,film, region, or substrate is referred to as being “on” another element,it can be directly on the other element or intervening elements may alsobe present.

Hereinafter, a driving system of a light source device for a displaydevice according to exemplary embodiments of the present invention willbe described in detail with reference to the accompanying drawings.

FIG. 1 is a block diagram of an LCD device according to an exemplaryembodiment of the present invention. FIG. 2 is an exploded perspectiveview schematically illustrating an LCD device according to an exemplaryembodiment of the present invention. FIG. 3 is an equivalent circuitview of a pixel unit of an LCD device according to an exemplaryembodiment of the present invention.

Referring to FIG. 1, an LCD device comprises an LC panel assembly 300, agate driver 400 and a data driver 500 that are each electricallyconnected to the LC panel assembly 300, a gray voltage generator 800electrically connected to the data driver 400, a light source section910 for supplying light to the LC panel assembly 300, a light sourcedriver 920 for controlling the light source section 910, and a signalcontroller 600 for controlling the above elements.

Referring to FIG. 2, an LCD device 10 comprises an LC module 350including a display unit 330 and a backlight 340, a front housing 361and a rear housing 362 for receiving and supporting the LC module 350,and mold frames 363 and 364.

The display unit 330 includes the LC panel assembly 300, a gate tapecarrier package (TCP) 410 and a data TCP 510 that are attached to the LCpanel assembly 300, and a gate printed circuit board (PCB) 450 and adata PCB 550 that are individually attached to the gate and data TCPs410 and 510, respectively.

In the structure shown in FIG. 2 and FIG. 3, the LC panel assembly 300includes a lower panel 100 and an upper panel 200 facing each other, andan LC layer 3 interposed between the lower and upper panels 100 and 200.In the circuit shown in FIG. 1 and FIG. 3, the LC panel assembly 300further includes display signal lines G₁-G_(n) and D₁-D_(m) and pixelsthat are connected the display signal lines G₁-G_(n) and D₁-D_(m) andarranged substantially in a matrix.

The display signal lines G₁-G_(n) and D₁-D_(m) are disposed on the lowerpanel 100 and include gate lines G₁-G_(n) for transmitting gate signals(also referred to as “scanning signals”), and data lines D₁-D_(m) fortransmitting data signals. The gate lines G₁-G_(n) extend substantiallyin a row direction and substantially parallel to each other, while thedata lines D₁-D_(m) extend substantially in a column direction andsubstantially parallel to each other. The row and column directions aresubstantially perpendicular to each other.

Each pixel includes a switching element Q that is electrically connectedto corresponding ones of the display signal lines G₁-G_(n) and D₁-D_(m),and an LC capacitor C_(LC) and a storage capacitor C_(ST) that areelectrically connected to the switching element Q. The storage capacitorC_(ST) may be omitted.

The switching element Q, such as a thin film transistor (TFT), isprovided on the lower panel 100 and has three terminals: a controlterminal electrically connected to one of the gate lines G₁-G_(n) (forexample, G_(i)); an input terminal electrically connected to one of thedata lines D₁-D_(m) (for example, D_(i)); and an output terminalelectrically connected to both the LC capacitor C_(LC) and the storagecapacitor C_(ST).

The LC capacitor C_(LC) includes a pixel electrode 190, provided on thelower panel 100, and a common electrode 270, provided on the upper panel200, as two terminals. The LC layer 3 interposed between the pixel andcommon electrodes 190 and 270 functions as a dielectric of the LCcapacitor C_(LC). The pixel electrode 190 is electrically connected tothe switching element Q, and the common electrode 270 is supplied with acommon voltage V_(com), and covers an entire surface of the upper panel200. As an alternative to the exemplary embodiment of FIG. 3, the commonelectrode 270 may be provided on the lower panel 100. In such a case, atleast one of the pixel electrode 190 and the common electrode 270 may beshaped as a bar or a stripe.

The storage capacitor C_(ST) is an auxiliary capacitor for the LCcapacitor C_(LC). When the pixel electrode 190 and a separate signalline (not shown), which is provided on the lower panel 100, areoverlapped with each other, with an insulator interposed between thepixel electrode 190 and the separate signal line, an overlap portionbecomes the storage capacitor C_(ST). The separate signal line issupplied with a predetermined voltage such as the common voltageV_(com). Alternatively, the storage capacitor C_(ST) may be formed byoverlapping of the pixel electrode 190 and a previous gate line that isplaced directly before the pixel electrode 190, interposing an insulatorbetween the pixel electrode 190 and the previous gate line.

For a color display, each pixel uniquely exhibits one of three primarycolors (i.e., spatial division), or sequentially exhibits the threeprimary colors in turn depending on time (i.e., temporal division), sothat a spatial or temporal sum of the primary colors is recognized as adesired color. FIG. 3 shows an example of the spatial division whereeach pixel includes a color filter 230, for exhibiting one of theprimary colors, disposed in an area of the upper panel 200 correspondingto the pixel electrode 190. As an alternative to the exemplaryembodiment of FIG. 3, the color filter 230 may be disposed on or underthe pixel electrode 190 of the lower panel 100.

Referring to FIG. 2, the backlight 340 is mounted proximate to the LCpanel assembly 300. The backlight 340 comprises a two-dimensional lightsource unit 341 and optical sheets 343. The two dimensional light sourceunit 341 includes a plurality of LED chips (not shown) and an array oflens pattern members 344. The mold frame 364 receives the light sourceunit 341 and the optical sheets 343.

The LED chips may utilize only white LED chips emitting white light, ora mixing array of red, green, and blue LED chips. A mixing array of awhite LED chip and a red LED chip may be also used. In such a case, thered LED chip functions as an auxiliary of the white LED chip.

In the exemplary embodiment shown in FIG. 2, the lens pattern members344 include three array lines disposed parallel to each other along alongitudinal direction of the LCD device, but a number of array linesand an arrangement of the array lines can be controlled depending on arequired brightness and size of the LCD device 10.

Polarizers 11 and 21 are provided on outer surfaces of the lower andupper panels 100 and 200 of the LC panel assembly 300 for polarizinglight emitted by the two-dimensional light source unit 341.

Referring to FIG. 1 and FIG. 2, the gray voltage generator 800 isincluded in the data PCB 550 and generates a first set and a second setof gray voltages related to a transmittance of the pixels. The grayvoltages in the first set have a positive polarity with respect to thecommon voltage v_(com), while the gray voltages of the second set havenegative polarity with respect to the common voltage v_(com).

The gate drivers 400 are individually mounted on each gate TCP 410,having a shape of an integrated circuit (IC) chip, and are individuallyconnected to the gate lines G₁-G_(n) of the LC panel assembly 300 fortransmitting the gate signals, consisting of combinations of gate-onvoltages V_(on) and gate-off voltages V_(off) input from an externaldevice, to the gate lines G₁-G_(n).

The data drivers 500 are individually mounted on each data TCP 510,having shapes of IC chips, and are individually connected to the datalines D₁-D_(m) of the LC panel assembly 300 for transmitting datavoltages, which are selected from the gray voltages supplied by the grayvoltage generator 800, to the data lines D₁-D_(m).

In another exemplary embodiment of the present invention, the gatedriver 400 or the data driver 500 is directly mounted on the lower panel100, having the shape of an IC chip, and in still another exemplaryembodiment of the present invention, the gate driver 400 or the datadriver 500 is integrated into the lower panel 100 along with otherelements. In the above cases, the gate PCB 450 and the gate TCP 410 orthe data PCB 550 and the data TCP 510 can be omitted.

The signal controller 600 is included in the data PCB 550 or the gatePCB 450 for controlling operation of the gate driver 400 and the datadriver 500.

Hereinafter, operation of the above-mentioned LCD device will bedescribed in detail.

The signal controller 600 receives input image signals R, G, and B andinput control signals for controlling a display of the LC panel assembly300. The input control signals include, for example, a verticalsynchronizing signal V_(sync), a horizontal synchronizing signalH_(sync) a main clock MCLK, a data enable signal DE, etc., from anexternal graphic controller (not shown). In response to the input imagesignals R, G, and B and the input control signals, the signal controller600 processes the input image signals R, G, and B suitably for operationof the LC panel assembly 300 and generates gate control signals CONT1and data control signals CONT2, and then outputs the gate controlsignals CONT1 and the data control signals CONT2 to the gate driver 400and the data driver 500, respectively.

The gate control signals CONT1 include a vertical synchronizing startsignal STV for informing the gate driver 400 of a beginning of a frame,a gate clock signal CPV for controlling an output time of the gate-onvoltages V_(on), and an output enable signal OE for defining a durationof the gate-on voltages V_(on).

The data control signals CONT2 include a horizontal synchronizing startsignal STH for informing the data driver 500 of a beginning of datatransmission, a load signal LOAD for instructing the data driver 500 toapply the data voltages to the data lines D₁-D_(m), a reverse signal RVSfor reversing a polarity of the data voltages with respect to the commonvoltage V_(com), and a data clock signal HCLK.

Responsive to the data control signals CONT2 from the signal controller600, the data driver 500 successively receives image data DAT for a rowof the pixels from the signal controller 600, shifts them, converts theimage data DAT into analog data voltages selected from the gray voltagesfrom the gray voltage generator 800, and then applies the data voltagesto data lines D₁-D_(m).

The gate driver 400 applies the gate-on voltages V_(on) to the gatelines G₁-G_(n) in response to the gate control signals CONT1 from thesignal controller 600, thereby turning on the switching elements Qconnected thereto. The data voltages applied to the data lines G₁-G_(n)are applied to corresponding pixels through turned-on switching elementsQ.

A difference between the data voltage applied to the pixel and thecommon voltage V_(com) is represented as a voltage across the LCcapacitor C_(LC), namely, a pixel voltage. LC molecules in the LCcapacitor C_(LC) have orientations depending on a magnitude of the pixelvoltage.

The light source driver 920 controls current applied to the light sourcesection 910 for switching LEDs of the light source section 910, and alsocontrols brightness of light from the LEDs.

When light emitted by the LEDs passes through the LC layer 3,polarization of the light is varied according to the orientations of theLC molecules. The polarizer converts a difference of light polarizationinto a difference of light transmittance.

By repeating this procedure by a unit of a horizontal period (which isdenoted by “1H” and equal to one period of the horizontal synchronizingsignal H_(sync), the data enable signal DE, and the gate clock CPV), allgate lines G₁-G_(n) are sequentially supplied with the gate-on voltagesV_(on) during a frame, thereby applying the data voltages to all pixels.When a next frame starts after finishing one frame, the reverse controlsignal RVS applied to the data driver 500 is controlled such that thepolarity of the data voltages is reversed with respect to that of theprevious frame (which is referred to as “frame inversion”). The reversecontrol signal RVS may also be controlled such that the polarity of thedata voltages flowing along a data line in one frame are reversed (forexample, line inversion and dot inversion), or the polarity of the datavoltages in one packet are reversed (for example, column inversion anddot inversion).

Hereinafter, the light source section 910, namely, the two-dimensionallight source unit 341 for the backlight 340 according to an exemplaryembodiment of the present invention will be described in detail withreference to FIG. 4.

FIG. 4 is a cross-sectional view of a two-dimensional light source usingLEDs according to an exemplary embodiment of the present invention.

The two-dimensional light source of this embodiment comprises: a basesubstrate 111 having a double-substrate structure including a PCBsubstrate 110 and a heat radiating substrate 120; a chip base 160disposed on the base substrate 111; an LED chip 130 disposed on the chipbase 160; a buffer layer 140 that covers the LED chip 130 and includes aflat upper surface; and an optical layer 150 disposed on the bufferlayer 140.

A lower surface of the PCB substrate 110, which is placed at a lowerpart of the base substrate 111, is provided with a wire member includingwires 181 and 182 for driving the two-dimensional light source and forsupplying power to the LED chips 130.

The heat radiating substrate 120 is disposed at an upper part of thebase substrate 111 and is formed with a metallic material havingprominent thermal conductivity such as aluminum (Al) or the like, butany different material having prominent thermal conductivity may be usedas an alternative to the metallic material. A lower surface of the heatradiating substrate 120 is attached to an upper surface of the PCBsubstrate 110.

The base substrate 111 is provided with holes passing from the lowersurface of the PCB substrate 110 to an upper surface of the heatradiating substrate 120, where a plug member including plugs 171 and 172is formed for electrically connecting an electrode member of the LEDchip 130 to the wires 181 and 182. The electrode member includes, forexample, a first electrode and a second electrode which may correspondto a positive electrode and a negative electrode, respectively.Additionally, coating films 180 are individually disposed on innersurfaces of the holes to insulate the plugs 171 and 172 from the heatradiating substrate 120. There is no need to form the coating films 180on an entire inner surface of the holes, thus, for example, the coatingfilms 180 may be formed on at least an inner surface of the holespassing through the heat radiating substrate 120. However, the coatingfilms 180 may be omitted if the heating radiating substrate 120 isformed of an insulating material.

The chip base 160, made of an insulating material, functions as aninsulating layer between the LED chip 130 and the heat radiatingsubstrate 120. The holes extend from the PCB substrate 110 to a top ofthe chip base 160, where the plugs 171 and 172 are filled.

Positive and negative electrodes of the LED chip 130 mounted on the chipbase 160 are electrically connected to the plugs 171 and 172 by a flipchip bonding or a wire bonding, etc., which will be described below.

The buffer layer 140, made of transparent resin, etc., covers the LEDchip 130 for protection, and a top surface thereof is planarized forfacilitating attachment of the optical layer 150, or other films. Theoptical layer 150 may be produced separately and has a film shape.

The optical layer 150 is a lens-array film having a predetermined shapethat uniformly disperses light emitted by the LED chip 130 to a widerarea. The optical layer 150 includes an embossed pattern of lenses andeach lens is a pattern member. Each lens is disposed at a portion of theoptical layer 150 corresponding to a position of an LED chip 130.Additionally, the lens may be constructed so that an acute angle formedbetween a straight line linking a center of a surface of the LED chip130 to a point on a surface of the lens and a main axis of the lens isalways larger than an acute angle formed between a normal for acorresponding point on a surface of the lens and the main axis of thelens. If the lens satisfies such a condition, light emitted by the LEDscan be uniformly dispersed to a wider area by passing through theoptical layer 150.

For the optical layer 150, various optical layers (or films), such as athin-film optical layer including a digital optics system, a holographicgrating layer, etc., as well as the above-mentioned lens-array film canbe used.

As the above, in this exemplary embodiment of the present invention, theLED chip 130 is a bare chip mounted on the base substrate 111 and thenthe optical layer 150 is integrally formed thereon. Accordingly, thetwo-dimensional light source becomes slim and a fabrication process ofthe backlight is simplified.

FIG. 5 is a cross-sectional view of a two-dimensional light source usingLEDs according to another exemplary embodiment of the present invention.

Like the exemplary embodiment shown in FIG. 4, the two-dimensional lightsource of this exemplary embodiment comprises: the base substrate 111′of a double-substrate structure including the PCB substrate 110 and aheat radiating substrate 120′; the chip base 160 disposed on the basesubstrate 111′; the LED chip 130 disposed on the chip base 160; a bufferlayer 140′ that covers the LED chip 130 and has a flat upper surface;and the optical layer 150 disposed on the buffer layer 140′.

In this exemplary embodiment, grooves 121 are formed at an upper surfaceof the heat radiating substrate 120, and the chip base 160 and the LEDchip 130 are disposed on a bottom portion of the groove 121. Such astructure makes the two-dimensional light source slimmer.

FIG. 6 is a cross-sectional view of a two-dimensional light source usingLEDs according to an additional exemplary embodiment of the presentinvention.

The exemplary embodiment shown in FIG. 6 is substantially same as theexemplary embodiment shown in FIG. 5 except that a diffusing layer 343is further provided between the buffer layer 140′ and the optical layer150.

The diffusing layer 343 disperses light emitted by the LED chip 130, sothat uniformity of surface light emitted by the two-dimensional lightsource is improved. Alternatively, any different optical film may beused in addition to, or instead of, the diffusing layer 343.

FIG. 7 is a cross-sectional view of a two-dimensional light source usingLEDs according to yet another exemplary embodiment of the presentinvention. The exemplary embodiment shown in FIG. 7 is substantiallysame as the exemplary embodiment shown in FIG. 6 except for an opticallayer 150′. Thus, a detailed explanation of like elements will beomitted.

In FIG. 7, there is shown a variation example of lenses employed in theoptical layer 150′. An outer surface of each of the lenses is dividedinto a curved centermost surface 152, whose center portion includes acone-shaped groove, and a curved center-edge surface 151, which upwardlyprotrudes, i.e., is convex. For example, the curved center-edge surface151 of each lens may form symmetry with respect to a main axis of thelens, which vertically extends from a center of the LED chip 130. Thelens may be constructed so that an acute angle formed between a straightline linking the center of the surface of the LED chip 130 to a point ofthe curved center-edge surface 151 of the lens and the main axis of thelens is always larger than an acute angle formed between a normal for acorresponding point of the curved center-edge surface 151 of the lensand the main axis of the lens. The curved centermost surface 152 of thelens may also be symmetrical with respect to the main axis of the lens,which vertically extends from the center of the LED chip 130.Additionally, the curved centermost surface 152 is formed to satisfy thefollowing equation.

A1+A2<90+sin⁻¹(1/n)

where, n is a refraction index, A1 is an obtuse angle formed between themain axis of the lens and a tangent line of a point of the curvedcentermost surface 152, and A2 is an acute angle formed between a linelinking the center of the LED chip 130 to the corresponding point on thecurved centermost surface 152 and the main axis of the lens.

When the curved center-edge surface 151 and the curved centermostsurface 152 of the lens satisfy the above equation, light emitted by theLED chip 130 can be dispersed uniformly to a wider area by passingthrough the optical layer 150.

FIG. 8 is a cross-sectional view of a two-dimensional light source usingthe LEDs according to still another exemplary embodiment of the presentinvention.

As compared to the embodiments shown in FIG. 4 to FIG. 7, this exemplaryembodiment further includes a support frame 710 disposed at a side of atwo-dimensional light source that may be one of those shown in FIG. 4 toFIG. 7. The support frame 710 forms a predetermined space on the opticallayer 150. The diffusing layer 343 and the optical films 342 areprovided on the support frame 710, above the space on the optical layer150. In such a configuration, the diffusing layer 343 serves as asupport plate for the optical films 342 and also disperses light likethe optical films 342. For the optical films 342 provided on thediffusing layer 343, a double brightness enhanced film (DBEF), abrightness enhanced film (BEF), etc., may be used.

FIG. 9 to FIG. 11 are cross-sectional views of various LEDs used for thetwo-dimensional light source according to exemplary embodiments of thepresent invention.

First, referring to FIG. 9, the heat radiating layer 120′ is coated witha reflection layer 112, and the chip base 160 is disposed on thereflection layer 112 disposed on an inner surface of a groove of theheat radiating layer 120′. Plug heads 173 and 174, passing throughholes, reach above the chip base 160 and are bonded to the LED chip bythe flip chip bonding method.

In this embodiment, the LED chip includes an insulating substrate 131,an N-type semiconductor layer 132, an activating layer 133, a P-typesemiconductor layer 134, and two electrodes 135 and 136 individuallydisposed on the P-type semiconductor layer 132 and the N-typesemiconductor layer 134, respectively. The two electrodes 135 and 136are connected to the plug heads 173 and 174 through conductive bumpers175 and 176. A technique for directly connecting the two electrodes 135and 136 and the plug heads 173 and 174 through the conductive bumpers175 and 176 after flipping over the LED chip, as mentioned above, is theflip chip bonding method previously cited.

Next, referring to FIG. 10, the heat radiating layer 120′ is coated withthe reflection layer 112, and the chip base 160 is provided on thereflection layer 112 disposed on the inner surface of the groove of theheat radiating layer 120′. Plug heads 173 and 174, passing throughholes, reach above the chip base 160 and are bonded to the LED chip bythe wire bonding method.

In this embodiment, the LED chip includes the insulating substrate 131,the N-type semiconductor layer 132, the activating layer 133, the P-typesemiconductor layer 134, and the two electrodes 135 and 136 individuallydisposed on the P-type semiconductor layer 132 and the N-typesemiconductor layer 134, respectively. The two electrodes 135 and 136are connected to the plug heads 173 and 174 through wires 177 and 178. Atechnique for contacting the insulating substrate 131 with the chip base160 and for connecting the two electrodes 135 and 136 to the plug heads173 and 174 through the wires 177 and 178 is the wire bonding techniquepreviously cited.

Next, referring to FIG. 11, the heat radiating layer 120′ is coated withthe reflection layer 112, and the chip base 160 is provided on thereflection layer 112 disposed on the inner surface of the groove of theheat radiating layer 120′. The plug heads 173 and 174 reach up to thetop of the chip base 160 passing through holes. A first electrode 351 ofthe LED chip is directly connected to the plug head 173 through aconductive bumper 175 and a second electrode 357 is bonded to the plughead 174 through a wire 178.

In this embodiment, the LED chip includes the first electrode 351, aconductive substrate 354, an N-type semiconductor 355, an activatinglayer 356, and the second electrode 357 successively disposed. The firstelectrode 351 is connected to the plug head 173 through the conductivebumper 175, while the second electrode 357 is connected to the plug head174 through the wire 178.

FIG. 12 is a plan view of a two-dimensional light source using LEDsaccording to another embodiment of the present invention and FIG. 13 isa cross-sectional view taken along XIII-XIII′ of FIG. 12.

In FIG. 12 and FIG. 13, there is shown a modular light source in whichmodules are arrayed substantially in a matrix. A light source used inthis embodiment may be any of the two-dimensional light sources shown inFIG. 4 to FIG. 11. The modular light source is more profitable forfabricating large-size LC panels.

To reinforce combination between the two-dimensional light sourcemodules 341, the light source modules 341 are disposed in a frame 364.The frame 364 surrounds and supports the light source modules 341.Alternatively, the frame 364 may be omitted if the modular light sourceincludes any combination element therein. As shown in FIG. 12, the lightsource modules 341 are disposed substantially in a matrix. For example,module 11 is disposed in a first row and a first column, module 21 isdisposed in a second row and the first column, module 12 is disposed inthe first row and a second column, etc.

A PCB substrate of the light source modules 341 is provided with wiresfor making a connection between the light source modules 341.

In the present invention, the LED chip 130 is a bare chip mounted on thebase substrate 111 and then the optical layer 150 is integrally formedthereon. Accordingly, the two-dimensional light source becomes slim anda fabrication process of the back light 340 is simplified.

The present invention should not be considered limited to the particularexamples described above, but rather should be understood to cover allaspects of the invention as fairly set out in the attached claims.Various modifications, equivalent processes, as well as numerousstructures to which the present invention may be applicable will bereadily apparent to those of skill in the art to which the presentinvention is directed upon review of the instant specification.

1. A light source comprising: a base substrate having a lower surface,an upper surface and a hole, the hole penetrating the base substrate; awire member disposed on the lower surface of the base substrate; a lightemitting diode (LED) chip disposed on the upper surface of the basesubstrate, the LED chip having an electrode member; a plug memberdisposed in the hole and connecting the electrode member to the wiremember through the hole; a buffer layer covering the LED chip; and anoptical layer disposed on the buffer layer, the optical layer includes apattern member disposed at a portion of the optical layer correspondingto the LED chip.
 2. The light source of claim 1, wherein the basesubstrate includes a printed circuit board (PCB) substrate and a heatradiating substrate disposed on the PCB substrate, the wire member isdisposed on the PCB substrate, and the LED chip is disposed on the heatradiating substrate.
 3. The light source of claim 2, wherein the heatradiating substrate is formed with a metallic material.
 4. The lightsource of claim 3, further comprising a chip base provided on the heatradiating substrate that insulates between the electrode member of theLED chip and the heat radiating substrate.
 5. The light source of claim4, wherein the chip base has a hole and the plug member is connected tothe electrode member of the LED chip through the hole of the chip base.6. The light source of claim 3, further comprising a coating film whichis disposed on at least an inner surface of the hole of the heatradiating substrate and insulates between the plug member and the heatradiating substrate.
 7. The light source of claim 1, wherein the patternmember comprises an embossed lens.
 8. The light source of claim 7,wherein the embossed lens is a convex lens. 9-16. (canceled)
 17. Thelight source of claim 1, wherein the LED chip is bonded to the plugmember by a flip chip bonding.
 18. (canceled)
 19. (canceled)
 20. Thelight source of claim 1, wherein the buffer layer has a planarized uppersurface. 21-28. (canceled)